Qualcomm's Snapdragon 820 Specs Released; Next-Generation Chip Thermally Efficient!

Qualcomm has officially unveiled their next-generation chip, the Snapdragon 820, reveals PC World.

Qualcomm showed the latest chipset at a press event in New York, Tuesday.

The company did not mention exact devices, but consumers can expect the chip to roll out alongside  flagship phones in January 2016, sometime during the Consumer Electrics Show, according to CNET.

In July, the company announced reduction in the workforce as part of its realignment plan.

Also, major Qualcomm partner, Samsung, decided to equip the Galaxy S6  with its proprietary Exynos 7420 processor instead of a Snapdragon 810 due to overheating issues.

The HTC One M9, Motorola Droid Turbo 2, OnePlus 2 and Google Nexus 6P all used the 810 chip.

The 820 shows Qualcomm's strengths, with power efficient, new custom Kyro cores integrated with the world's best modem, reports PC Mag.

"Is it thermally efficient? Does it deliver more battery life? The answer to all of these things is absolutely yes," said Qualcomm's CMO, Tim McDonough.

The company placed several different devices that were outfitted with the chipset, to demonstrate the 820's capabilities.

The 820 rendered a 720-pixel resolution graphics and images on a loop for mobile gaming.

The chipset's Adreno 530 graphics processing unit will be 40 percent more power efficient than its 810 predecessor, claims Qualcomm.It also exhibits a 40 percent increase in performance.

To further reduce pixelation and smoothen out the edges of graphics, the chip uses a temporal or time-based, antiliasing technology.

The 820 will also consume 60 percent less power than 801 chipset and also introduces Qualcomm's Quick Charge 3.0 technology.

With this version, phones are expected to charge four times faster when compared to standard charging methods.

The 820 supports wireless charging, and compatible to devices sporting Micro-USB, USB Type-A and USB Type-C charging ports.

Qualcomm's Snapdragon 820 supports Cat-12 LTE technology and the 802.11 a/d Wi-Fi specification.Faster connectivity speeds should translate.

The San Diego, Calif. based company claims the chip has a peak downlink rate of 600Mbps and an uplink rate of 150Mbps on LTE, faster than the 810, which had a 450Mbps downlink peak and a 50Mbps uplink peak.